Modul'up TE

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Object Data

1 Revision

Last Updated

15/05/2019

Available for:
  • Logo: Autodesk Revit

Modul’up T.E. is a quick and easy to install solution for damp subfloors with up to 97% RH. Featuring our AquaBlock back layer embossing, Modul’up T.E. allows the subfloor to breathe and moisture to dissipate. Installed using our single sided tape system, Modul’up is free of the usual constraints associated with traditional adhered floor covering such as setting, drying and VOC emissions. As a result areas can be walked on immediately, dramatically reducing downtime and the disruption caused to premises which are still in use. 

Modul’up T.E is available in 2m wide rolls.

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