Modul'up TE

  • Views 1.7k
  • Comments 0
  • Rating- / 5
    Rate this product
    1/5 Rating1/5 Rating2/5 Rating2/5 Rating3/5 Rating3/5 Rating4/5 Rating4/5 Rating5/5 Rating5/5 Rating
Object Data

1 Revision

Last Updated


Available for:
  • Logo: Autodesk Revit

Modul’up T.E. is a quick and easy to install solution for damp subfloors with up to 97% RH. Featuring our AquaBlock back layer embossing, Modul’up T.E. allows the subfloor to breathe and moisture to dissipate. Installed using our single sided tape system, Modul’up is free of the usual constraints associated with traditional adhered floor covering such as setting, drying and VOC emissions. As a result areas can be walked on immediately, dramatically reducing downtime and the disruption caused to premises which are still in use. 

Modul’up T.E is available in 2m wide rolls.

Read more

Embed Product

To embed this product into any website simply copy and paste the code below.

Community comments

You might also like